Micron Technology is preparing a major expansion in Japan with plans to invest 1.5 trillion yen (approximately $9.6 billion) to build a new semiconductor facility in Hiroshima. The upcoming plant will focus on manufacturing next-generation high-bandwidth memory (HBM) chips, according to people familiar with the development.
Construction is expected to begin in May next year at Micron’s existing site in Hiroshima, with commercial shipments targeted around 2028. Japan’s Ministry of Economy, Trade and Industry is reportedly prepared to contribute up to 500 billion yen in support for the project as part of its broader strategy to revive the nation’s semiconductor sector.
Japan has been actively working to rejuvenate its chip industry by offering substantial subsidies to global manufacturers. Besides supporting Micron, the government has extended backing to companies like TSMC and is also financing the creation of a new production plant that will manufacture advanced logic chips using IBM technology.
The surge in demand for HBM chips is being fueled by rapid advancements in artificial intelligence, cloud services, and large-scale data centres. By strengthening operations in Hiroshima, Micron aims to reduce reliance on production in Taiwan and enhance its ability to compete with leading memory chip producers, including SK Hynix.
The expanded facility is expected to reinforce Japan’s position as a key player in the fast-growing high-performance memory market while supporting global supply chain diversification.
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